Semiconductor apparatus, solid-state image sensing apparatus, and camera system

ABSTRACT

A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a Continuation of U.S. application Ser. No.15/264,272, filed Sep. 13, 2016, which is a Continuation of U.S.application Ser. No. 15/078,984, filed Mar. 23, 2016, now U.S. Pat. No.9,509,933, issued on Nov. 29, 2016, which is a Continuation of U.S.application Ser. No. 14/348,722, filed Mar. 31, 2014, now U.S. Pat. No.9,350,929, issued on May 24, 2016, which is a National Stage Applicationof PCT/JP/2012-006497, filed Oct. 10, 2012, which claims priority toJapanese Patent Application Number 2011-232282, filed in the JapanesePatent Office on Oct. 21, 2011, the entire disclosures of which areincorporated herein by reference in their entirety.

TECHNICAL FIELD

The present technology relates to a semiconductor apparatus having astructure where a plurality of sensors are arranged in array form, asolid-state image sensing apparatus, and a camera system.

BACKGROUND ART

For semiconductor apparatuses such as CMOS image sensors having astructure where a plurality of sensors are arranged in array form, therehave been increased demands for highly-developed signal processing andminiaturization.

In order to realize this, Patent Document 1, for example, has proposed amethod of laminating chips together to integrate a larger signalprocessing circuit having the same chip size as before.

Such a semiconductor apparatus has a laminated structure of a chip(hereinafter referred to as an analog chip) where a sensor array forgenerating analog signals is mounted and a chip (hereinafter referred toas a digital chip) where a logic circuit for signal processing ismounted.

Then, the semiconductor apparatus connects these chips together throughTC(S)Vs (Through Contact (Silicon) VIAs) formed in the analog chip so asto be laminated one on the other, thereby realizing miniaturization.

A challenge for the miniaturization with such a method is to dividecircuit blocks related to signal paths for flowing data output from thesensor array into the upper and lower chips.

For example, in an image sensor, the above system uses several thousandor more wirings for fetching signals from the sensor array so as tocorrespond to the number of pixels arranged in a vertical or horizontaldirection.

For this reason, it is necessary to concentrate the TCVs so as to beplaced into the paths. Accordingly, a change in the signal of one of theTCVs adjacent to the other of the TCVs with a large amplitude interfereswith the signal of the target TCV and causes an error in the signal.

As countermeasures for this interference, the signals transmittedthrough the TCVs are limited to those (using one or more binary signallines) quantized in a voltage direction in the related art.

Hereinafter, the countermeasures will be described in detail.

Hereinafter, as the first countermeasures, a description will be givenof a case where the signals transmitted through the TCVs aretime-discretized and quantized signals, i.e., digital signals. Then, asthe second countermeasures, a description will be given of a case wherethe signals transmitted through the TCVs are continuous-time andquantized signals.

First, a description will be given of the countermeasures where thesignals transmitted through the TCVs are time-discretized and quantizedsignals, i.e., digital signals.

FIG. 1 is a diagram showing a first configuration example where thesignals transmitted through the TCVs are time-discretized and quantizedsignals in a semiconductor apparatus using laminated chips.

A semiconductor apparatus 1 has a laminated structure of an analog chip2 and a digital chip 3.

Among the laminated chips, the analog chip 2 of the semiconductorapparatus 1 manufactured according to an analog process has a pluralityof sensors 4(-0, -1, . . . ) arranged in array form.

The outputs of the sensors 4 are connected to sampling switches 6(-0,-1, . . . ) for time-discretizing signals through amplifiers 5(-0, -1, .. . ).

Here, if the power of the signals output from the sensors 4 issubstantially large, the outputs of the sensors 4 may be directlyconnected to the sampling switches without passing through theamplifiers.

The signals time-discretized by the sampling switches 6 are quantized ina voltage direction using quantizers 7(-0, -1, . . . ).

The quantizers 7 are composed of a plurality of comparators, and each ofthe comparators compares a certain signal level with an input signallevel to quantize the signal.

Here, the quantizers 7 do not have to complete the quantization at atime but may be circuits configured to perform a plurality of stages.

The signals digitized in such a process are transmitted to the digitalchip 3 through TCVs 8(-0, -1, . . . ) and then processed by a digitalsignal processing circuit 9.

In this case, the signals transmitted through the TCVs 8 are binarysignals of a power supply level or a ground (GND) level, and no error iscaused in the signals unless the signals are reduced in size to aboutthe half of a power supply voltage. Further, even if the parasiticcapacitances of the TCVs 8 cause a delay in the signals, no problemoccurs within the setup margin of the signal processing circuit 9.

Next, a description will be given of another configuration example wherethe signals transmitted through the TCVs are digital signals.

FIG. 2 is a diagram showing a second configuration example where thesignals transmitted through the TCVs are time-discretized and quantizedsignals in a semiconductor apparatus using laminated chips.

In this case, in a semiconductor apparatus 1A, the output signals ofsensors 4 are not directly time-discretized by the sampling switches 6but are time-discretized by SH (sample hold) circuits 10(-0, -1, . . . )provided near the sensors 4.

The SH circuits 10 can be realized by only switches and capacitances inthe simplest way.

Next, a description will be given of a case where the configurationexample shown in FIG. 2 where the signals transmitted through the TCVsare digital signals is applied to an image sensor.

FIG. 3 is a diagram showing a third configuration example where thesignals transmitted through the TCVs are time-discretized and quantizedsignals in a semiconductor apparatus using laminated chips and is adiagram showing an example where the configuration example shown in FIG.2 is applied to a CMOS image sensor.

Note that in FIG. 3, the same constituents as those of FIGS. 1 and 2 aredenoted by the same symbols to facilitate the understanding of the thirdconfiguration example.

Mainstream CMOS image sensors have a FD (Floating Diffusion) amplifierfor every pixel and are of a column-parallel output type that selectscertain rows in a pixel array and simultaneously reads them in a columndirection.

This is because parallel processing is advantageous due to the fact thatthe FD amplifiers arranged in the pixels hardly provide satisfactorydriving performance and thus a data rate has to be reduced.

Such a CMOS image sensor 20 is configured to include a pixel array part21 serving as a sensor array and a row selection circuit (V scanner) 22that drives pixels.

The pixel array part 21 has pixel circuits 30 arranged in M (rows)×N(columns) matrix form.

The row selection circuit 22 controls the operations of the pixelsarranged in any rows of the pixel array part 21. The row selectioncircuit 22 controls the pixels through control lines LSEL, LRST, andLTRG.

As an example, FIG. 3 shows a case where each of the pixel circuits 30includes four transistors.

The pixel circuit 30 has a photoelectric conversion element (hereinaftersimply referred to as a PD when necessary) 31 composed of, for example,a photodiode (PD). With respect to the one photoelectric conversionelement 31, the pixel circuit 30 has four transistors serving as activeelements, i.e., a transfer transistor 32, a reset transistor 33, anamplification transistor 34, and a selection transistor 35.

In the CMOS image sensor 20, FDs (Floating Diffusions) (capacitances)and the transfer transistors (transfer switches) 32 realize the functionof the sample hold circuits shown in the block diagram of FIG. 2 withrespect to the photoelectric conversion elements (photodiodes) 31serving as sensors.

Second, a description will be given of a case where the signalstransmitted through the TCVs are continuous-time and quantized signals.

FIG. 4 is a diagram showing a first configuration example where thesignals transmitted through the TCVs are continuous-time and quantizedsignals in a semiconductor apparatus using laminated chips.

As in the case of the semiconductor apparatus 1A shown in FIG. 2, asemiconductor apparatus 1C shown in FIG. 4 causes comparators 23(-0, -1,. . . ) to compare signals discretized by the SH circuit 10 with rampwaves generated by a ramp signal generator (not shown), therebyconverting analog signals output from the sensors 4 into time-axissignals.

The semiconductor apparatus 1C transmits the quantized sensor signalsthus converted to the digital chip 2C through the TCVs 8 and quantizesthe time-axis information with counters (TDCs: Time to DigitalConverters) 24, thereby obtaining digital signals.

FIG. 5 is a diagram where the above operations are shown using waveformsin a time axis.

When the comparison results of the analog signals and ramp waves RAMPare output from the comparators 23 as signals S23, the counters 24 stoptheir counting operations and the signals are determined. Here, a timingfor starting the ramp waves RAMP and a timing for starting the countingoperations with the counters 24 are synchronized with each other. Withthis operation, voltage information is converted into time information.

When such a transmitting method is used, the signals transmitted throughthe TCVs 8 are quantized to a power supply level or a ground (GND) levelas in a case where digital signals are transmitted.

FIG. 6 is a diagram showing an example where the configuration shown inFIG. 4 is applied to a CMOS image sensor in a semiconductor apparatususing laminated chips.

Note that in FIG. 6, the same constituents as those of FIGS. 3 and 4 aredenoted by the same symbols to facilitate the understanding of thesemiconductor apparatus.

As in the case of FIG. 4, the semiconductor apparatus causes thecomparators 23(-0, -1, . . . ) to perform the comparison of ramp wavesgenerated by a ramp signal generator 25, thereby converting analogsignals output from pixels 30 into time-axis signals.

The semiconductor apparatus transmits the quantized sensor signals thusconverted to a digital chip 3D through the TCVs 8, quantizes thetime-axis information with the counters (TDCs) 24, and stores obtaineddigital signals in latches (memories) 26.

The digital signals stored in the latches 26 are horizontallytransferred through transfer lines by the signal processing circuit 9.

Note that the comparators 23, the counters 24, and the latches 26arranged in respective columns form a so-called single slope ADconverter (ADC).

FIG. 7 is a diagram showing the configuration of a general single slopeAD converter.

A single slope AD converter 40 shown in FIG. 7 is configured to includea comparator 41, a counter 42, and a ramp signal generator 43.

As described above, in the single slope AD converter 40, the comparator41 compares ramp waves (slope signal) generated by the ramp signalgenerator 43 such as a DAC with an input signal IN input to the ADconverter 40 to control the subsequent-stage counter 42, therebyperforming AD conversion.

As a significant performance index of the AD converter 40, noisecharacteristics are known. The noise characteristics of the comparator41 often dominate the noise characteristics of the AD converter 40.Examples of noise include thermal noise serving as wide-band noise,flicker noise serving as low-frequency noise, RTS(Random-Telegraph-Signal) noise, or the like, each of which degrades thenoise characteristics.

As the methods of reducing such noise, an increase in the sizes oftransistors and the arrangement of mirror capacitances at thefirst-stage outputs of comparators (see Patent Document 2) have beengenerally known.

CITATION LIST Patent Document

Patent Document 1: Japanese Patent Laid-open No. 2011-159958

Patent Document 2: Japanese Patent Laid-open No. 2010-93641

DISCLOSURE OF THE INVENTION Problem to be Solved by the Invention

However, the cases where the signals transmitted through the TCVs arethe digital signals as shown in FIGS. 1 to 3 cause the followingproblems.

The first problem is that the enhancement of the resolution of thequantizers results in an increase in the number of the TCVs.

As described above, it is general that about several thousand sensors(pixels) are simultaneously read in the image sensor. In the case wherethe countermeasures are performed, the TCVs obtained by multiplyingseveral thousands by resolution (bit numbers) have to be provided, whichresults in an increase in excessive area and cost.

The second problem is that the signals transmitted through the TCVs havea large amplitude. Accordingly, the TCVs having a larger parasiticcapacitance than normal via holes (VIA holes) have to be charged at alarge signal amplitude, which results in an increase in power and powersupply noise.

The third problem is that the areas of the quantizers per se becomelarge. In order to realize the sensors, the analog chips are generallymanufactured in a process having a peculiar step compared with thedigital chips, which results in an increase in cost per area.Accordingly, an increase in the areas of the analog chips largelyaffects cost.

Meanwhile, the cases where the signals transmitted through the TCVs arethe continuous-time and quantized signals as shown in FIGS. 4 and 6cause the following problems.

The first problem is that the adjacent TCVs interfere with the signals.Because the signals transmitted through the TCVs are binary signals of apower supply level or a GND level, the TCVs are likely to interfere withthe adjacent signals.

In this system, the signals withstand the interference from the adjacentTCVs when the outputs of the comparators are substantially stable andclose to either a power supply level or a GND level. On the other hand,the signals are susceptible to the interference from the adjacent TCVswhen the outputs of the comparators are being changed.

This is because the outputs of the comparators have finite rising timeand the overlap of noise with the signals causes an error when theoutputs exceed a certain level.

FIG. 8 is a diagram showing the influence of the error caused when theadjacent TCVs interfere with the signals.

If no interference from the adjacent TCVs occurs, outputs CMOUT of thecomparators are those as indicated by dashed lines. On the other hand,if the interference from the adjacent TCVs occurs, the outputs CMOUT ofthe comparators are those as indicated by a solid line. An error ER iscaused when the dashed lines and the solid line exceed a threshold VTHof the counters.

In this system, because the timing at which the signals of thecomparators rise is changed depending on the level of the outputs of thesensors even if the timings of signals CLK 1 for driving the SH circuitsare the same, it is difficult to manage the signals at the same timing.

In addition, from the reason above, the error is caused when the outputsof the adjacent comparators are changed at almost the same time.Therefore, even if the timings of the signals are synchronized with eachother, the interference from the adjacent TCVs cannot be prevented inprinciple.

The arrangement of a shield between the TCVs can alleviate this problembut increases the distance between the TCVs, which results in anincrease in the areas of the chips.

The second problem is that the increased output signals of thecomparators result in an increase in power and power supply noise. Theincrease in power and power supply noise is caused by the same reason asthe case where digital signals are transmitted.

The third problem is that the areas of the comparators per se result inan increase in cost as in the case where digital signals aretransmitted. As compared with the case where digital signals aretransmitted, only one comparison is performed and the circuits aresimple. Accordingly, an increase in cost is smaller compared with a casewhere the quantizers of high resolution are used. However, in terms ofthe number of the comparators, the several thousand comparators have tobe provided like the TCVs, which is unable to be disregarded.

As described above, in the semiconductor apparatuses that have thelaminated structure and process the signals output from the sensors, thequantization at a voltage level has been performed in order to preventthe adjacent TCVs from interfering with the signals.

Then, any of the mounting methods described above increases the areas ofthe analog chips having many manufacturing steps, which results in anincrease in cost and the amplitude of the signals transmitted throughthe TCVs. Therefore, an increase in power and power supply noise becomesa problem.

Moreover, in view of the semiconductor apparatus using the single slopeAD converters, the increase in the sizes of the transistors as themethod of reducing noise also increases parasitic capacitances as a sideeffect, which results in an increase in the areas of the circuits and adecrease in operating speed. Therefore, problems such as an increase inthe area of each of the comparators and the limitation of an operatingspeed occur. In addition, due to these constraints, it is difficult toobtain a certain noise reduction effect.

Also in the method of arranging the mirror capacitances at thefirst-stage outputs of the comparators, because it is basically a methodof reducing a noise band, i.e., a noise operating band, and thus anoperating speed is reduced. Therefore, it is difficult to obtain acertain noise reduction effect.

Further, due to the principle that noise is reduced by the limitation ofa band, this method has a problem of being not effective forlow-frequency noise such as flicker noise and RTS noise.

Under these circumstances, it has been long expected to further reducenoise, particularly low-frequency noise in the comparators.

The present technology has been made to provide a semiconductorapparatus, a solid-state image sensing apparatus, and a camera systemcapable of reducing interference between signals transmitted throughadjacent via holes, preventing an increase in the number of the viaholes, reducing the area of a chip having sensors thereon and the numberof mounting steps thereof, and eventually reducing cost.

Means for Solving the Problem

A semiconductor apparatus according to a first aspect of the presenttechnology includes a first chip having a plurality of sensors arrangedin array form and a second chip, the first chip and the second chipbeing bonded together to form a laminated structure, a wiring betweenthe first chip and the second chip being connected through via holes,the first chip transmitting signals obtained by time-discretizing analogsignals generated by the respective sensors to the second chip throughthe corresponding via holes, the second chip having a function ofsampling the signals transmitted from the first chip through the viaholes at a timing different from a timing at which the signals aresampled by the first chip and a function of quantizing the sampledsignals to obtain digital signals.

A solid-state image sensing apparatus according to a second aspect ofthe present technology includes a pixel array part and a pixel signalreading part, the pixel array part having a plurality of pixels arrangedin matrix form, the pixels performing photoelectric conversion, thepixel signal reading part reading time-discretized pixel signals inunits of the plurality of pixels from the pixel array part, the pixelsignal reading part having a plurality of comparators, a plurality ofcounters, a first chip, and a second chip, the plurality of comparatorsbeing arranged corresponding to an arrangement of columns of the pixels,comparing a reading signal potential with a ramp signal, and outputtingsignals based on the comparison result, the operations of the pluralityof counters being controlled by outputs of the comparators, the counterscounting comparison times of the corresponding comparators to performquantization, the first chip and the second chip being bonded togetherto form a laminated structure, the first chip having the pixel arraypart and signal lines that transmit time-discretized analog pixelsignals, the second chip having the pixel signal reading part, the firstchip and the second chip having a wiring connected therebetween throughvia holes.

A camera system according to a third aspect of the present technologyincludes a solid-state image sensing apparatus and an optical systemthat forms a subject image on the solid-state image sensing apparatus,the solid-state image sensing apparatus including a pixel array part anda pixel signal reading part, the pixel array part having a plurality ofpixels arranged in matrix form, the pixels performing photoelectricconversion, the pixel signal reading part reading time-discretized pixelsignals in units of the plurality of pixels from the pixel array part,the pixel signal reading part having a plurality of comparators, aplurality of counters, a first chip, and a second chip, the plurality ofcomparators being arranged corresponding to an arrangement of columns ofthe pixels, comparing a reading signal potential with a ramp signal, andoutputting signals based on the comparison result, the operations of theplurality of counters being controlled by outputs of the comparators,the counters counting comparison times of the corresponding comparatorsto perform quantization, the first chip and the second chip being bondedtogether to form a laminated structure, the first chip having the pixelarray part and signal lines that transmit time-discretized analog pixelsignals, the second chip having the pixel signal reading part, the firstchip and the second chip having a wiring connected therebetween throughvia holes.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 A diagram showing a first configuration example where signalstransmitted through TCVs are time-discretized and quantized signals in asemiconductor apparatus using laminated chips.

FIG. 2 A diagram showing a second configuration example where thesignals transmitted through the TCVs are time-discretized and quantizedsignals in a semiconductor apparatus using laminated chips.

FIG. 3 A diagram showing a third configuration example where the signalstransmitted through the TCVs are time-discretized and quantized signalsin a semiconductor apparatus using laminated chips and is a diagramshowing an example where the configuration example shown in FIG. 2 isapplied to a CMOS image sensor.

FIG. 4 A diagram showing a first configuration example where the signalstransmitted through the TCVs are continuous-time and quantized signalsin a semiconductor apparatus using laminated chips.

FIG. 5 A diagram where the operations of the semiconductor apparatusshown in FIG. 4 are shown using waveforms in a time axis.

FIG. 6 A diagram showing a second configuration example where thesignals transmitted through the TCVs are time-discretized and quantizedsignals in a semiconductor apparatus using laminated chips and is adiagram applied to a CMOS image sensor.

FIG. 7 A diagram showing the configuration of a general single slope ADconverter.

FIG. 8 A diagram showing the influence of the error caused when theadjacent TCVs interfere with the signals.

FIG. 9 A diagram showing an example of the laminated structure of asemiconductor apparatus according to an embodiment of the presenttechnology.

FIG. 10 A diagram showing a first arrangement configuration example ofcircuits or the like in the semiconductor apparatus according to theembodiment.

FIG. 11 Diagrams showing the time relationship between the signals ofthe semiconductor apparatus according to the embodiment.

FIG. 12 A diagram showing a second arrangement configuration example ofthe circuits or the like in the semiconductor apparatus according to theembodiment.

FIG. 13 A diagram showing a third arrangement configuration example ofthe circuits or the like in the semiconductor apparatus according to theembodiment.

FIG. 14 A diagram showing using time-axis waveforms that interferencefrom the adjacent columns can be reduced by the operations of thesemiconductor apparatus shown in FIG. 13.

FIG. 15 A diagram showing a basic configuration example of a CMOS imagesensor (solid-state image sensing apparatus) according to theembodiment.

FIG. 16 A diagram showing an example of a pixel of a CMOS image sensorcomposed of four transistors according to the embodiment.

FIG. 17 A block diagram showing a configuration example of a CMOS imagesensor (solid-state image sensing apparatus) having column-parallel ADCsaccording to the embodiment.

FIG. 18 A diagram showing a first arrangement configuration example ofthe circuits or the like in the CMOS image sensor having column-parallelADCs according to the embodiment.

FIG. 19 A diagram showing an example where the TCVs for transmittingdiscrete-time analog signals are concentrated and separated from theTCVs for transmitting digital signals.

FIG. 20 A diagram showing a second arrangement configuration example ofthe circuits or the like in the CMOS image sensor having column-parallelADCs according to the embodiment.

FIG. 21 A diagram showing a third arrangement configuration example ofthe circuits or the like in the CMOS image sensor having column-parallelADCs according to the embodiment.

FIG. 22 A circuit diagram showing a first configuration example of acomparator according to the embodiment.

FIG. 23 A diagram showing the basic concept of a comparator having anisolator and capable of reducing low-frequency noise according to theembodiment.

FIG. 24 A diagram showing the basic concept of a comparator having noisolator as a comparison example of the comparator shown in FIG. 23.

FIG. 25 A diagram showing an example where a parasitic capacitanceexists between the input node and the output node of the Gm amplifier ofthe comparator according to the embodiment shown in FIG. 23.

FIG. 26 Diagrams showing the parasitic capacitance and the waveforms ofthe nodes generated when the slope signal is input in the configurationexample shown in FIG. 25.

FIG. 27 A diagram showing an example where a parasitic capacitanceexists between the input node and the output node of the Gm amplifier asthe comparison example shown in FIG. 24.

FIG. 28 Diagrams showing the parasitic capacitance and the waveforms ofthe nodes generated when the slope signal is input in the configurationexample shown in FIG. 27.

FIG. 29 A diagram for explaining the noise source of the first-stage Gmamplifier of the comparator.

FIG. 30 Diagrams showing an example of converting voltage noise intotime noise.

FIG. 31 A diagram showing a first circuit configuration example of acomparator capable of reducing low-frequency noise according to theembodiment.

FIG. 32 A diagram showing a second circuit configuration example of thecomparator capable of reducing low-frequency noise according to theembodiment.

FIG. 33 A diagram showing a third circuit configuration example of thecomparator capable of reducing low-frequency noise according to theembodiment.

FIG. 34 A diagram showing a fourth circuit configuration example of thecomparator capable of reducing low-frequency noise according to theembodiment.

FIG. 35 A diagram showing a fifth circuit configuration example of thecomparator capable of reducing low-frequency noise according to theembodiment.

FIG. 36 A diagram showing a sixth circuit configuration example of thecomparator capable of reducing low-frequency noise according to theembodiment.

FIG. 37 Diagrams for explaining an effective mounting example of thecomparator capable of reducing low-frequency noise according to theembodiment.

FIG. 38 A diagram showing an example of the configuration of a camerasystem to which the solid-state image sensing apparatus according to theembodiment is applied.

MODE(S) FOR CARRYING OUT THE INVENTION

Hereinafter, a description will be given of an embodiment of the presenttechnology with reference to the drawings.

Note that the description will be given in the following order.

1. Outline of Semiconductor Apparatus 1.1 First ArrangementConfiguration Example in Semiconductor Apparatus 1.2 Second ArrangementConfiguration Example in Semiconductor Apparatus 1.3 Third ArrangementConfiguration Example in Semiconductor Apparatus 2. Outline ofSolid-State Image Sensing Apparatus 2.1 Basic Configuration Example ofSolid-State Image Sensing Apparatus 2.2 Configuration Example ofSolid-State Image Sensing Apparatus Having Column-Parallel ADCs 2.3First Arrangement Configuration Example in Solid-State Image SensingApparatus 2.4 Second Arrangement Configuration Example in Solid-StateImage Sensing Apparatus 2.5 Second Arrangement Configuration Example inSolid-State Image Sensing Apparatus 3. Configuration Example ofComparator 3.1 Basic Configuration Example of Comparator 3.2 BasicConfiguration Example of Comparator Capable of Reducing Low-FrequencyNoise 3.3 Specific Circuit Configuration Example of Comparator Capableof Reducing Low-Frequency Noise 4. Configuration Example of CameraSystem <1. Outline of Semiconductor Apparatus>

FIG. 9 is a diagram showing an example of the laminated structure of asemiconductor apparatus according to the embodiment.

A semiconductor apparatus 100 according to the embodiment has aplurality of sensors arranged in array form and including photoelectricconversion elements and the like.

Hereinafter, a configuration example of the semiconductor apparatushaving such a configuration will be first described. Then, aconfiguration example of a CMOS image sensor serving as a solid-stateimage sensing apparatus will be described as an example of thesemiconductor apparatus. Further, a specific configuration example of asingle slope AD converter having high noise reduction effect andapplicable to the solid-state image sensing apparatus will be described.

As shown in FIG. 9, the semiconductor apparatus 100 has the laminatedstructure of a first chip (upper chip) 110 and a second chip (lowerchip) 120.

The laminated first chip 110 and the second chip 120 are electricallyconnected to each other through via holes (TCVs) formed in the firstchip 110.

The semiconductor apparatus 100 is formed to have the laminatedstructure in such a manner that the first and second chips 110 and 120are bonded together at a wafer level and cut out by dicing.

In the laminated structure of the upper and lower two chips, the firstchip 110 is formed of an analog chip (sensor chip) having the pluralityof sensors arranged in array form.

The second chip 120 is formed of a logic chip (digital chip) includingcircuits that quantize analog signals transferred from the first chip110 through the TCVs and a signal processing circuit.

The second chip 120 has a bonding pad BPD and an input/output circuit,and the first chip 110 has openings OPN for use in wire-bonding to thesecond chip 120.

Then, the semiconductor apparatus 100 of the laminated structure of thetwo chips according to the embodiment has the following characteristicconfiguration.

The electrical connection between the first chip 110 and the second chip120 is performed through, for example, the via holes (TCVs).

The TCVs are arranged at chip ends or between the pad and a circuitregion.

The TCVs for transmitting control signals and supplying power are mainlyconcentrated at, for example, the four corners of the chip, by which thesignal wiring region of the first chip 110 can be reduced.

The reduction of the number of the wiring layers of the first chip 110results in an increase in the resistance of a power source line and anincrease in IR-Drop. As countermeasures for this problem, the effectivearrangement of the TCVs can improve the noise control, stable supply, orthe like of a power supply in the first chip 110 using the wiring of thesecond chip 120.

<1.1 First Arrangement Configuration Example in Semiconductor Apparatus>

FIG. 10 is a diagram showing a first arrangement configuration exampleof circuits or the like in a semiconductor apparatus according to theembodiment.

In the semiconductor apparatus 100A shown in FIG. 10, a first chip 110Aand a second chip 120A are two-dimensionally developed to facilitate theunderstanding of the arrangement of the circuits such as the first chip110A and the second chip 120A of a laminated structure.

The first chip 110A has a plurality of sensors 111(-0, -1, . . . )arranged in array form and first signal lines LSG1 (-0, -1, . . . ) thattransmit analog signals (sensor signals) output from the sensors 111(-0, -1, . . . ).

In the first chip 110A, sample hold (SH) circuits 112 (-0, -1, . . . )that sample the sensor signals of the sensors 111(-0, -1, . . . ) at afirst clock CLK11 are arranged on the first signal lines LSG1 (-0, -1, .. . ).

On the first signal lines LSG1 (-0, -1, . . . ), amplifiers 113 (-0, -1,. . . ) that amplify the sensor signals output from the sample hold (SH)circuits 112 (-0, -1, . . . ) are arranged.

Further, the first chip 110A has TCVs 114 (-0, -1, . . . ) thatelectrically connect the first signal lines LSG1 (-0, -1, . . . ) to thesecond chip 120A side and transmit the sensor signals.

Note that although not shown in the figure, the first chip 110A has TCVsfor supplying power and transmitting control signals.

The second chip 120A has second signal lines LSG2 (-0, -1, . . . )connected to the respective TCVs 114 formed in the first chip 110A.

On the second signal lines LSG2 (-0, -1, . . . ), sampling switches 121(-0, -1, . . . ) that sample the sensor signals transmitted through theTCVs 114 at a second clock CLK12 are arranged.

On the second signal lines LSG2 (-0, -1, . . . ), quantizers 122(-0, -1,. . . ) that quantize the signals sampled by the sampling switches 121(-0, -1, . . . ) are arranged.

The second chip 120A has a signal processing circuit 123 that performsthe digital calculation processing of the signals quantized by thequantizers 122-1, -2, . . . ).

In the semiconductor apparatus 100A, the signals output from the sensors111 are sample-held by the SH circuits 112 and then transmitted to theTCVs 114 through the amplifiers 113.

Here, if the power of the signals output from the sensors 111 from theSH circuits 112 is substantially large, the amplifiers may not bearranged.

The signals transmitted through the TCVs 114 are sampled by the samplingswitches 121 of the second chip 120A serving as a logic chip (digitalchip) and then quantized by the quantizers 122 in a voltage direction.The data thus digitized is calculated by the signal processing circuit123.

According to the technology shown in FIG. 2, the signals transmittedthrough the TCVs are quantized in a voltage direction.

On the contrary, according to the present technology, the signalstransmitted through the TCVs are discretized in a time direction. Inother words, the signals transmitted through the TCVs are continuoussignals, i.e., discrete-time analog signals in a voltage direction.

Also in this case, interference from the adjacent TCVs 114 occurs in thesignals.

However, the interference from the adjacent TCVs with respect to thesignals can be prevented by appropriately controlling the timing of thefirst clock CLK11 at which the signals are sample-held by the SHcircuits 112 and the timing of the second clock CLK12 at which thediscrete-time analog signals are sampled in the second chip 120A.

FIGS. 11(A) to (C) are diagrams showing the time relationship betweenthe signals of the semiconductor apparatus according to the embodiment.

FIG. 11(A) shows the signal waveform of a node ND11 to which the signaltransmitted through the TCV is supplied, FIG. 11(B) shows the firstclock CLK11, and FIG. 11(C) shows the second clock CLK12.

Attention is now paid to the node ND11 of the discrete-time analogsignal transmitted through the TCV 114.

Because the first clock CLK11 uses the timing common to the SH circuits112 connected to all the sensors 111, the signal transition time of thenode ND11 and that of the adjacent node ND12 are ideally synchronizedwith each other.

However, if an error occurs in the timing for outputting the signal fromthe sensor between the node ND11 and the node N12 due to, for example,the delay of the signal through the wiring, a whisker resulting from theinterference is caused in the signal of the node N11 as shown in FIG.11(A).

However, the signal has been time-discretized by the SH circuit 112 inan interval where one data is transmitted. Therefore, the signal has afixed value in the interval and is stabilized at a desired value afterthe lapse of sufficient time.

The semiconductor apparatus is so driven as to perform the samplingusing the second clock CLK12 at the timing at which the signal isstabilized at the substantial value, thereby making it possible toreduce the error caused by the interference from the TCVs 114 to anegligible level.

<1.2 Second Arrangement Configuration Example in SemiconductorApparatus>

FIG. 12 is a diagram showing a second arrangement configuration exampleof the circuits or the like in a semiconductor apparatus according tothe embodiment.

The semiconductor apparatus 100B shown in FIG. 12 is different from thesemiconductor apparatus 100A shown in FIG. 10 in the following point.

That is, in a second chip 120B, the sampling switches 121 (-0, -1, . . .) and the quantizers 122 (-0, -1, . . . ) are arranged on the secondsignal lines LSG2 (-0, -1, . . . ) in a reverse order (reverselyconnected).

According to the present technology, the sampling and the quantizationat the timing of the second clock CLK12 may be performed in the order ofthe quantization in continuous time and the sampling switches 121connected to the quantizers 122.

In this case, the operations of the sampling switches 121 are realizedby the provision of flip-flop circuits with respect to the signals.

The configuration shown in FIG. 10 may generate kT/C noise when thesampling switches 121 are turned off, which may cause a problem.However, the configuration shown in FIG. 12 is free from kT/C noise.

<1.3 Third Arrangement Configuration Example in Semiconductor Apparatus>

FIG. 13 is a diagram showing a third arrangement configuration exampleof the circuits or the like in the semiconductor apparatus according tothe embodiment.

A semiconductor apparatus 100C shown in FIG. 13 is different from thesemiconductor apparatuses 100A and 100B shown in FIGS. 10 and 12 in thefollowing point.

That is, a second chip 120C has comparators 124 (-0, -1, . . . ) andcounters 125 (-0, -1, . . . ) instead of the sampling switches and thequantizers.

In the second chip 120C, the comparators 124 compare a ramp signal RAMPwith the sensor signals transmitted through the TCVs 114 so as to beconverted from a voltage axis to a time axis, and then the counters 125quantizes time information.

FIG. 14 shows that the interference from the adjacent columns can bereduced based on the same principle as that of FIG. 11. In theconfiguration shown in FIG. 13, an AD conversion operation is performedin such a manner that ramp waves RAMP are compared with the signals andthe time is converted into a digital value by the counters 124.Accordingly, the AD converter does not fetch the signals while the rampwaves and counters 124 do not operate.

Here, as shown in FIG. 14, the transition of the ramp waves and theoperations of the counters are started after the output of the signalLSGO-N is substantially stabilized, thereby making it possible to reducethe error caused by the interference from the adjacent TCVs as in thecase of FIG. 11.

<2. Outline of Solid-State Image Sensing Apparatus>

A description will be given of a configuration example of a CMOS imagesensor serving as a solid-state image sensing apparatus as an example ofthe semiconductor apparatus according to the embodiment.

<2.1 Basic Configuration of Solid-State Image Sensing Apparatus>

FIG. 15 is a diagram showing a basic configuration example of a CMOSimage sensor (solid-state image sensing apparatus) according to theembodiment.

A CMOS image sensor 200 shown in FIG. 15 has a pixel array part 210, arow selection circuit (Vdec) 220, and a column reading circuit (AFE)230.

The row selection circuit 220 and the column reading circuit 230 form apixel signal reading part.

The CMOS image sensor 200 serving as a semiconductor apparatus employsthe laminated structure shown in FIG. 9.

According to the embodiment, the laminated structure is basicallyconfigured such that the first chip 110 has the pixel array part 210 andthe second chip 120 has the row selection circuit 220 and the columnreading circuit 230 forming the pixel signal reading part.

Then, signals for driving pixels, analog read signals of the pixels(sensors), a power supply voltage, and the like are transferred betweenthe first chip 110 and the second chip 120 through the TCVs formed inthe first chip 110.

The pixel array part 210 has a plurality of pixel circuits 210Atwo-dimensionally arranged in M (rows)×N (columns) (matrix) form.

FIG. 16 is a diagram showing an example of a pixel of a CMOS imagesensor composed of four transistors according to the embodiment.

The pixel circuit 210A has a photoelectric conversion element(hereinafter simply referred to as a PD when necessary) 211 composed of,for example, a photodiode (PD).

Then, with respect to the one photoelectric conversion element 211, thepixel circuit 210A has four transistors serving as active elements,i.e., a transfer transistor 212, a reset transistor 213, anamplification transistor 214, and a selection transistor 215.

The photoelectric conversion element 211 photoelectrically convertsincident light into charges (here, electrons) of an amount correspondingto the amount of the light.

The transfer transistor 212 serving as a transfer element is connectedbetween the photoelectric conversion element 211 and a floatingdiffusion FD serving as an input node. A transfer signal TRG serving asa control signal is supplied to the gate (transfer gate) of the transfertransistor 212 through a transfer control line LTRG.

Thus, the transfer transistor 212 transfers the electronsphotoelectrically converted by the photoelectric conversion element 211to the floating diffusion FD.

The reset transistor 213 is connected between a power supply line LVDDto which a power supply VDD is supplied and the floating diffusion FD. Areset signal RST serving as a control signal is supplied to the gate ofthe reset transistor 213 through a reset control line LRST.

Thus, the reset transistor 213 serving as a reset element resets thepotential of the floating diffusion FD to that of the power supply lineLVDD.

The floating diffusion FD is connected to the gate of the amplificationtransistor 214 serving as an amplification element. That is, thefloating diffusion FD functions as the input node of the amplificationtransistor 214 serving as an amplification element.

The amplification transistor 214 and the selection transistor 215 areconnected in series between the power supply line LVDD to which thepower supply voltage VDD is supplied and a signal line LSGN.

Thus, the amplification transistor 214 is connected to the signal lineLSGN through the selection transistor 215 and constitutes a sourcefollower circuit with a constant current source IS outside the pixels.

Then, a selection signal SEL serving as a control signal correspondingto an address signal is supplied to the gate of the selection transistor215 through the selection control line LSEL, and the selectiontransistor 215 is turned on.

When the selection transistor 215 is turned on, the amplificationtransistor 214 amplifies the potential of the floating diffusion FD andoutputs a voltage corresponding to the potential to the signal lineLSGN. The voltage output from each of the pixels through the signal lineLSGN is output to the column reading circuit 230.

Because the respective gates of the transfer transistor 212, the resettransistor 213, and the selection transistor 215 are, for example,connected in units of rows, these operations are simultaneouslyperformed for each of the pixels by one row.

In the pixel array part 210, the wiring of the reset control line LRST,the transfer control line LTRG, and the selection control line LSEL isinstalled as a group in units of the rows of pixel arrangement.

Each of the control lines LRST, LTRG, and LSEL has M-lines.

The reset control lines LRST, the transfer control lines LTRG, and theselection control lines LSEL are driven by the row selection circuit220.

As described above, the pixel array part 210 having such a configurationincludes the signal wiring and the control wiring and is formed in thefirst chip 110.

Further, according to the embodiment, the constant current sources ISconstituting the source follower circuits with the amplificationtransistors 214 arranged in the first chip 110 are arranged in thesecond chip 120.

The row selection circuit 220 controls the operations of the pixelsarranged in any rows of the pixel array part 210. The row selectioncircuit 220 controls the pixels through the control lines LSEL, LRST,and LTRG.

Depending on, for example, a shutter mode switch signal, the rowselection circuit 220 switches an exposure system to either a rollingshutter system where an exposure is performed for each row or a globalshutter system where an exposure is simultaneously performed for allpixels, thereby performing image driving control.

The column reading circuit 230 receives the data of the rows of thepixels read and controlled by the row selection circuit 220 through thesignal output lines LSGN and then transfers the received data to asubsequent-stage signal processing circuit.

The column reading circuit 230 includes a CDS circuit and an ADC (AnalogDigital Converter).

<2.2 Configuration Example of Solid-State Image Sensing Apparatus HavingColumn-Parallel ADCs>

Note that a CMOS image sensor according to the embodiment is notparticularly limited but may be configured as a CMOS image sensorhaving, for example, column-parallel analog-digital convertingapparatuses (hereinafter abbreviated as ADCs).

FIG. 17 is a block diagram showing a configuration example of a CMOSimage sensor (solid-state image sensing apparatus) havingcolumn-parallel ADCs according to the embodiment.

As shown in FIG. 17, a solid-state image sensing element 300 has a pixelarray part 310 serving as an image sensing part, a row selection circuit320 serving as a pixel driving part, a horizontal transfer scanningcircuit 330, and a timing control circuit 340.

Moreover, the solid-state image sensing element 300 has an ADC group350, a digital-analog converting apparatus (hereinafter abbreviated as aDAC (Digital Analog Converter)) 360 serving as a ramp signal generator,amplification circuits (S/A) 370, a signal processing circuit 380, and ahorizontal transfer line 390.

The pixel array part 310 has the plurality of pixels shown in, forexample, FIG. 16 arranged in matrix form, each of the pixels having aphotoelectric conversion element (photodiode) and an in-pixel amplifier.

Further, the solid-state image sensing element 300 has the followingcircuits serving as control circuits that successively read signalstransferred from the pixel array part 310.

That is, the solid-state image sensing element 300 has, as the controlcircuits, the timing control circuit 340 that generates an internalclock, the row selection circuit 320 that controls row addresses and rowscanning, and the horizontal transfer scanning circuit 330 that controlscolumn addresses and column scanning.

In the ADC group 350, a plurality of columns of single slope ADCs eachhaving a comparator 351, a counter 352, and a latch 353 are arranged.

The comparator 351 compares a reference voltage Vslop having a rampwaveform (RAMP) obtained by varying a reference voltage generated by theDAC 360 in a staircase pattern with an analog signal obtained from apixel through the vertical signal line LSGN for each row line.

The counter 352 counts the comparison time of the comparator 351.

The ADC group 350 has an n-bit digital signal conversion function and isarranged for each vertical signal line (column line) to constitute acolumn-parallel ADC block.

The output of the latch 353 is connected to the horizontal transfer line390 having, for example, a 2n bit width.

Further, the 2n amplification circuits 370 and the signal processingcircuit 380 corresponding to the horizontal transfer line 390 arearranged.

In the ADC group 350, the comparator 351 arranged for each columncompares the analog signal (potential VSL) read to the vertical signalline LSGN with the reference voltage Vslop (slope waveform that has acertain inclination and linearly varies).

At this time, the counter 352 arranged for each column operates as isthe case with the comparator 351. The potential (analog signal) VSL ofthe vertical signal line is converted into a digital signal in such amanner that the certain potential Vslop of the ramp waveform RAMP variescorresponding to the counter value.

In order to vary the reference voltage Vslop, variation in voltage isconverted into variation in time, and the time is counted at a certaincycle (clock) to convert the potential into the digital value.

Then, when the analog electric signal VSL crosses the reference voltageVslop, the output of the comparator 351 is inverted to stop the inputclock of the counter 352, thereby completing the AD conversion.

After the completion of the AD conversion described above, thehorizontal transfer scanning circuit 330 inputs data held by the latch353 to the signal processing circuit 380 through the horizontal transferline 390 and the amplification circuits 370, thereby generating atwo-dimensional image.

The column-parallel output processing is thus performed.

Note that a specific configuration of the comparator 351 employed herewill be described in detail below.

The CMOS image sensor 300 serving as a semiconductor apparatus alsoemploys the laminated structure shown in FIG. 9.

In the laminated structure according to the embodiment, the first chip110 basically has the pixel array part 310.

The second chip 120 has the row selection circuit 320, the horizontaltransfer scanning circuit 330, the timing control circuit 340, the ADCgroup 350, the DAC (ramp signal generator) 360, the amplificationcircuits (S/A) 370, the signal processing circuit 380, and thehorizontal transfer line 390.

Then, signals for driving the pixels, analog read signals of the pixels(sensors), a power supply voltage, and the like are transferred betweenthe first chip 110 and the second chip 120 through the TCVs formed inthe first chip 110.

<2.3 First Arrangement Configuration Example in Solid-State ImageSensing Apparatus>

Here, a description will be given of a configuration example where theconstituents of the CMOS image sensor having the column-parallel ADCsshown in FIG. 17 are arranged in a first chip and a second chip of alaminated structure.

FIG. 18 is a diagram showing a first arrangement configuration exampleof the circuits or the like in a CMOS image sensor havingcolumn-parallel ADCs according to the embodiment.

Also in FIG. 18, a first chip 110D and a second chip 120D aretwo-dimensionally developed to facilitate the understanding of thearrangement of the circuits or the like such as the first chip 110D andthe second chip 120D of the laminated structure.

Further, in FIG. 18, the timing control circuit 340, the amplificationcircuits 370, and the signal processing circuit 380 are omitted. Thesecond chip 110D also has these circuits.

As described above, in the laminated structure, the first chip 110Dbasically has the pixel array part 310.

The second chip 120D has the row selection circuit 320, the horizontaltransfer scanning circuit 330, the timing control circuit 340, thecomparators 351 of the ADC group 350, the counters 352, the latches 353,and the DAC (ramp signal generator) 360.

Then, signals for driving the pixels, analog read signals of the pixels(sensors), a power supply voltage, and the like are transferred betweenthe first chip 110D and the second chip 120D through the TCVs 114 formedin the first chip 110D.

Note that according to the embodiment, the current sources ISconstituting the source follower circuits with the amplificationtransistors or the like of the pixels arranged in the first chip 110Dare arranged in the second chip 120D.

The exemplified arrangement of the constituents shown in FIG. 18 isperformed in the same manner as that shown in FIG. 13.

In the CMOS image sensor 300A shown in FIG. 18, the transfer controlsignal TRG, which is output from the column selection circuit 320 andused for controlling the on/off of the transfer transistors (transferswitches), has the same function as that of the first clock CLK11 shownin FIG. 13.

On the other hand, the timing for generating the ramp waves iscontrolled to substantially stabilize the VSL(m), thereby making itpossible to transmit the signals while reducing the error caused by theinterference from the adjacent TCVs as shown in FIG. 14.

FIG. 19 is a diagram showing an example where the TCVs for transmittingthe discrete-time analog signals are concentrated and separated from theTCVs for transmitting the digital signals.

This configuration can reduce the interference from the adjacent TCVs.

However, in the system shown in FIG. 18, for example, the row selectioncircuit 320 outputs normal digital signals for turning on/off theswitches, and it is not easy to reduce the interference with the signallines LSGN(n) based on these signals.

Therefore, according to the present technology, as shown in FIG. 19, itis effective to concentrate the TCVs for transmitting the discrete-timeanalog signals and separate such TCVs from the TCVs for transmitting thedigital signals.

In an example shown in FIG. 19, a first chip 110E has regions 410 and420 where the TCVs for transmitting the digital signals are arranged onboth right and left sides of the pixel array part 310 in FIG. 19.

Further, a region 430 where the TCVs for transmitting the analog signalsare arranged is formed on the lower side of the pixel array part 310 inFIG. 19.

<2.4 Second Arrangement Configuration Example in Solid-State ImageSensing Apparatus>

FIG. 20 is a diagram showing a second arrangement configuration exampleof the circuits or the like in a CMOS image sensor havingcolumn-parallel ADCs according to the embodiment.

The CMOS image sensor 300B shown in FIG. 20 shows a case where onefloating diffusion FD is shared by a plurality of pixels in a pixelarray part 310B.

In the example shown in FIG. 20, the floating diffusion FD, the resettransistor 213, the amplification transistor 214, and the selectiontransistor 215 are shared by two pixels.

Each of the pixels is configured to include the photoelectric conversionelement (photodiode) 211 and the transfer transistor 212.

Also in this case, a first chip 110F basically has the pixel array part310B, and other configurations are the same as those shown in FIG. 18.

<2.5 Third Arrangement Configuration Example in Solid-State ImageSensing Apparatus>

FIG. 21 is a diagram showing a third arrangement configuration exampleof the circuits or the like in a CMOS image sensor havingcolumn-parallel ADCs according to the embodiment.

As in the case of FIG. 20, a CMOS image sensor 300C shown in FIG. 21shows a case where one floating diffusion FD is shared by a plurality ofpixels in a pixel array part 310C.

Also in this case, a first chip 110G basically has the pixel array part310C.

In this example, TCVs 114G are formed near shared regions.

The TCVs 114G are formed in such a manner that the connection electrodesmade of metal (for example, Cu) formed in the first chip 110G and asecond chip 120G are connected to each other by metal. The pixel signalsoutput to the signal lines LSGN are supplied to the comparators 351 ofthe second chip 120G through the TCVs 114G.

<3. Configuration Example of Comparator>

Next, a description will be given of a specific configuration example ofthe comparator 351 that is applied to the ADC group and forms the columnADC.

In performing the present technology described above, there is a concernthat the noise of the quantizers and the comparators arranged in thesecond chip serving as a digital chip becomes larger than that of thequantizers and the comparators arranged in the analog chip.

Hereinafter, a description will be given of the configuration examplesof the comparators effective for the noise in the CMOS image sensorsshown in FIGS. 17 to 21.

<3.1 Basic Configuration Example of Comparator>

FIG. 22 is a circuit diagram showing a first configuration example ofthe comparator according to the embodiment.

Hereinafter, the comparator will be denoted by symbol 500.

FIG. 22 shows a configuration example of the comparator that greatlyrestricts a band using a mirror capacitance to reduce noise. With such aconfiguration, the comparator is caused to output a small noise power.Therefore, it is possible to compensate for a disadvantage caused whenthe comparator is arranged in the second chip serving as a digital chip.

As shown in FIG. 22, the comparator 500 arranged for each column has afirst amplifier 510, a second amplifier 520, and a capacitor C530serving as a capacitance for presenting a mirror effect, the firstamplifier 510 and the second amplifier 520 being cascade-connected toeach other.

Further, a capacitance is connected between the input and the output ofthe source grounded amplifier of the second amplifier 520 on the secondstage. The capacitance presents a mirror effect and is thus equivalentto a gain-multiplied capacitance connected to a source grounded input.

Thus, the band of the comparator 500 is largely narrowed with the smallcapacitance.

In order to determine an operating point for every column at starting arow operation, the comparator 500 has an initializing (auto zero: AZ)and sampling function.

Note that according to the embodiment, a first conductive type is eithera p-channel or an n-channel, and a second conductive type is either then-channel or the p-channel.

The first amplifier 510 has p-channel MOS (PMOS) transistors PT511 toPT514 and n-channel MOS(NMOS) transistors NT511 to NT513 as insulationgate type field effect transistors.

The first amplifier 510 has first and second capacitors C511 and C512 assampling capacitances (input capacitances) of an AZ level.

The source of the PMOS transistor PT511 and the source of the PMOStransistor PT512 are connected to the power supply potential source VDD.

The drain of the PMOS transistor PT511 is connected to the drain of theNMOS transistor NT511, and a node ND511 is formed at the connectionpoint between them. Further, the drain and the gate of the PMOStransistor PT511 are connected to each other, and the connection pointbetween them is connected to the gate of the PMOS transistor 512.

The drain of the PMOS transistor PT512 is connected to the drain of theNMOS transistor NT512, and an output node ND512 of the first amplifier510 is formed at the connection point between them.

The source of the NMOS transistor NT511 and the source of the NMOStransistor NT512 are connected to each other, and the connection pointbetween them is connected to the drain of the NMOS transistor NT513. Thesource of the NMOS transistor NT513 is connected to a referencepotential source (for example, ground potential) GND.

The gate of the NMOS transistor NT511 is connected to a first electrodeof the capacitor C511, and a node ND513 is formed at the connectionpoint between them. Further, a second electrode of the capacitor C511 isconnected to an input terminal TRAMP of the ramp signal RAMP.

The gate of the NMOS transistor NT512 is connected to a first electrodeof the capacitor C512, and a node ND514 is formed at the connectionpoint between them. Further, a second electrode of the capacitor C512 isconnected to an input terminal TVSL of the analog signal VSL.

Furthermore, the gate of the NMOS transistor NT513 is connected to aninput terminal TBIAS of a bias signal BIAS.

The source of the PMOS transistor PT513 is connected to the node ND511,and the drain thereof is connected to the node ND513. The source of thePMOS transistor PT514 is connected to the node ND512, and the drainthereof is connected to the node ND514.

Further, the gates of the PMOS transistors PT513 and PT514 are commonlyconnected to an input terminal TPSEL of a low-level and active first AZsignal PSEL.

In the first amplifier 510 having such a configuration, the PMOStransistors PT511 and PT512 constitute a current mirror circuit.

Further, the NMOS transistors NT511 and NT512 constitute a differentialcomparison part (transconductance amplifier (Gm amplifier)) 511 thatuses the NMOS transistor NT513 as a power supply source.

Further, the PMOS transistors PT513 and PT514 function as AZ (auto-zero:initialization) switches, and the capacitors C511 and C512 function assampling capacitances of an AZ level.

Then, an output signal 1stcomp of the first amplifier 510 is output fromthe output node ND512 to the second amplifier 520.

The second amplifier 520 has a PMOS transistor PT521, NMOS transistorsNT521 and NT522, and a third capacitor C521 serving as a samplingcapacitance of an AZ level.

The source of the PMOS transistor PT521 is connected to the power supplypotential source VDD, and the gate thereof is connected to the outputnode ND512 of the first amplifier 510.

The drain of the PMOS transistor PT521 is connected to the drain of theNMOS transistor NT521, and an output node ND521 is formed at theconnection point between them.

The source of the NMOS transistor NT521 is connected to the groundpotential GND, and the gate thereof is connected to a first electrode ofthe capacitor C521. A node ND522 is formed at the connection pointbetween them. A second electrode of the capacitor C521 is connected tothe ground potential GND.

The drain of the NMOS transistor NT522 is connected to the node ND521,and the source thereof is connected to the node ND522.

Further, the gate of the NMOS transistor NT522 is connected to an inputterminal TNSEL of a high-level and active second AZ signal NSEL.

The second AZ signal NSEL has a level complementary to that of the firstAZ signal PSEL supplied to the first amplifier 510.

In the second amplifier 520 having such a configuration, the PMOStransistor PT521 constitutes an input and amplification circuit.

Further, the NMOS transistor PT522 functions as an AZ switch, and thecapacitor C521 functions as a sampling capacitance of an AZ level.

Further, the output node ND521 of the second amplifier 520 is connectedto an output terminal TOUT of the comparator 500.

A first electrode of the capacitor C530 is connected to the gate (input)of the PMOS transistor PT521 as a source grounded amplifier, and asecond electrode thereof is connected to the drain (output) of the PMOStransistor PT521.

The capacitor C530 presents a mirror effect and is thus equivalent to again-multiplied capacitance connected to a source grounded input.

Assuming that the gain of the PMOS transistor PT521 is A_(V2) and thecapacitance of the capacitor C530 is C, the capacitance of the output ofthe first amplifier 510 is gain-multiplied like {C×(1+A_(V2))}.Therefore, the capacitance value of the capacitor C530 may be small.

Thus, the band of the comparator 500 is largely narrowed with the smallcapacitance.

In the arrangement of a mirror capacitance in the output of the firstamplifier 510 on the first stage of the comparator 500, there isbasically employed a method of reducing a noise band, i.e., a noiseoperating band. Therefore, an operating speed is reduced, and a certainnoise reduction effect is small.

Moreover, due to the principle that noise is reduced by the limitationof a band, this configuration is not effective for low-frequency noisesuch as flicker noise and RTS noise.

Hereinafter, a description will be made of a configuration capable offurther reducing noise, particularly, low-frequency noise in thecomparator 500.

The comparator that will be described below has characteristics in theconfiguration of a first amplifier.

Note that in the following description, the same constituents as thoseof FIG. 22 will be basically denoted by the same symbols to facilitatethe understanding of the constituents.

<3.2 Basic Configuration Example of Comparator Capable of ReducingLow-Frequency Noise> [Basic Concept of Configuration]

FIG. 23 is a diagram showing the basic concept of a comparator having anisolator and capable of reducing low-frequency noise according to theembodiment.

FIG. 24 is a diagram showing the basic concept of a comparator having noisolator as a comparison example of the comparator shown in FIG. 23.

The comparator 500A according to the embodiment has a first amplifier510A including sampling capacitances C511 and C512 of an auto zerolevel, an auto zero switch AZS511 and a first-stage transconductance(Gm) amplifier 511, and a second amplifier 520A following the firstamplifier 510A.

Then, the comparator 500A according to the embodiment is different fromthe comparator 500B shown in FIG. 24 as the comparative example in thatit includes the isolator 530 arranged on at least the side of the outputnode of the first amplifier 510A and used for reducing a voltagefluctuation.

Note that FIGS. 23 and 24 show only the second amplifier on thesubsequent stage of the first amplifier 510A, but the number ofamplifiers is not limited.

Further, in the following description, the node ND 513 on one input sideof the first amplifier 510A will be regarded as a node a, and the nodeND514 on the other input side thereof will be regarded a node b.Moreover, the output part of the Gm amplifier 511 of the first amplifier510A will be regarded as a node c, and the output node ND512 of thefirst amplifier 510A will be regarded as a node d.

The node c of the output part of the differential comparison part (Gmamplifier) 511 of the first amplifier 510A corresponds to the drainterminal of the NMOS transistor NT512 of the first amplifier 510 in thecomparator 500 shown in FIG. 22.

The isolator 530 isolates the voltage of the output node c of thefirst-stage Gm amplifier 511 from the large-amplitude voltage node d andkeeps the same at a constant level as much as possible.

The auto zero switch AZS511 is connected between the output node d ofthe isolator 530 and the high impedance node b.

[Waveforms Generated when Slope Signal is Input]

Here, consideration is given to a case where a fixed input signal isinput to one input (IN2) of the comparator and a slope signal is inputto the other input (IN1) thereof. Here, the slope signal refers to asignal whose signal level increases or decreases with a certaininclination as in the case of RAMP waveforms.

FIG. 25 is a diagram showing an example where a parasitic capacitanceexists between the input node and the output node of the Gm amplifier ofthe comparator according to the embodiment shown in FIG. 23.

FIGS. 26(A) to (D) are diagrams showing the parasitic capacitance andthe waveforms of the respective nodes generated when the slope signal isinput in the configuration example shown in FIG. 25.

FIG. 27 is a diagram showing an example where a parasitic capacitanceexists between the input node and the output node of the Gm amplifier asthe comparison example shown in FIG. 24.

FIGS. 28(A) to (D) are diagrams showing the parasitic capacitance andthe waveforms of the respective nodes generated when the slope signal isinput in the configuration example shown in FIG. 27.

When the fixed input signal and the slope signal are input to the oneinput (IN2) and the other input (IN1), respectively, of the comparator500A according to the embodiment, the node d has a waveform of anextremely larger slope than the input slope signal as shown in FIG.26(B).

However, the isolator 530 keeps the voltage of the output node c of thefirst-stage Gm amplifier 511 at a constant level.

Accordingly, even if the parasitic capacitance Cp exists between thenode b and the node c, the node b is kept at a constant voltage withoutsuffering from disturbance as shown in FIG. 26(C).

Accordingly, as shown in FIG. 26(D), the input slope (IN1) is directlyapplied as the differential input signal (a-b) of the first-stage Gmamplifier 511 of the comparator 500A.

On the other hand, in the configuration of the comparator 500B of thecomparative example, the node c has a waveform of an extremely largeslope as shown in FIG. 28(B).

Thus, the slope is provided to the node b through the parasiticcapacitance Cp existing between the node b and the node c (FIG. 7).

As a result, as shown in FIG. 28(D), the slope of the differential inputsignal (a-b) of the first-stage Gm amplifier of the comparator 500B islargely reduced compared with the input slope (IN1).

[Noise Reduction]

Next, consideration is given to noise reduction.

FIG. 29 is a diagram for explaining the noise source of the first-stageGm amplifier of the comparator.

FIGS. 30(A) and (B) are diagrams showing an example of convertingvoltage noise into time noise.

In the first-stage Gm amplifier 511 of the comparators 500A and 500B, aconstant input conversion noise source exists. As shown in FIG. 29, thenoise source can be described as the input conversion noise source NOS.

When the fixed input signal and the slope signal (waveform) are input toone input (IN2) and the other input (IN1), respectively, of thecomparators 500A and 500B, the above voltage noise is converted in themanner as shown in FIGS. 30(A) and (B).

That is, the slope of the differential input signal (a-b) of thefirst-stage Gm amplifier 511 is converted into time-axis noise (i.e.,jitter) as a conversion gain.

Accordingly, with the attenuation of the slope of the differential inputsignal (a-b), the output noise of the comparators 500A and 500B isincreased.

As described above, the comparator 500A of this configuration reducesthe attenuation of the slope as shown in FIG. 30(A). As a result, theoutput noise of the comparator 500A is reduced.

Note that the operation of the first-stage Gm amplifier 511 of thecomparator 500A is accelerated with an increase in the slope of thedifferential input signal (a-b).

That is, because the band of the comparator 500A also increases, thecontribution of the increase in the slope of the differential inputsignal (a-b) is smaller than direct proportion as for noise such asthermal noise reaching high frequency.

On the other hand, the contribution of the increase in the slope of thedifferential input signal (a-b) is close to direct proportion as forlow-frequency noise such as flicker noise and RTS noise. That is, thepresent technology is particularly effective for the reduction of suchthe low-frequency noise.

<3.3 Specific Circuit Configuration Example of Comparator Capable ofReducing Low-Frequency Noise> [First Circuit Configuration Example]

FIG. 31 is a diagram showing a first circuit configuration example of acomparator capable of reducing low-frequency noise according to theembodiment.

The comparator 500C shown in FIG. 31 is so configured as to have anisolator 530C between the output node ND512 and the drain terminal(output terminal) of the NMOS transistor NT512 forming an NMOSdifferential pair (Gm amplifier) in the first amplifier 510 of thecomparator 500 shown in FIG. 22.

Note that in FIG. 31, the PMOS transistors PT513 and PT514 serving asauto zero switches shown in FIG. 22 are indicated as auto zero switchesAZS511 and AZS512, and the NMOS transistor NT513 is indicated as a powersupply 1511.

In the case of the comparator 500C shown in FIG. 31, the parasiticcapacitance Cp shown in FIG. 25 is mainly formed by a capacitance Cgdexisting between the gate and the drain of the NMOS transistor NT512 ofthe NMOS differential pair and by a parasitic capacitance existingbetween metal wirings.

[Second Circuit Configuration Example]

FIG. 32 is a diagram showing a second circuit configuration example of acomparator capable of reducing low-frequency noise according to theembodiment.

In the comparator 500D shown in FIG. 32, the isolator 530C of thecomparator 500C shown in FIG. 31 is formed by an NMOS transistor NT514.

The drain of the NMOS transistor NT514 is connected to an output nodeND512(d) of a first amplifier 510D, and the source thereof is connectedto the drain (node c) of the NMOS transistor NT512 forming a Gmamplifier.

Further, in the comparator 500D shown in FIG. 32, the gate of the NMOStransistor NT514 forming the isolator 530C is connected to the supplyline of a bias voltage VBIAS.

Thus, a constant current flows through the NMOS transistor NT514.Therefore, even if a parasitic capacitance exists between the gate(input node b) and the drain (output node c) of the NMOS transistorNT512, it is possible to suppress a voltage fluctuation and reducelow-frequency noise.

Note that the transistor used for the isolation is not limited to thesame type as the differential pair transistor.

[Third Circuit Configuration Example]

FIG. 33 is a diagram showing a third circuit configuration example of acomparator capable of reducing low-frequency noise according to theembodiment.

The comparator 500E shown in FIG. 33 is different from the comparator500D shown in FIG. 32 in that the gate of the NMOS transistor NT514serving as the isolator 530C is connected to a power supply voltagesource VDD rather than being connected to the supply line of the biasvoltage VBIAS.

The comparator 500D shown in FIG. 32 uses another bias voltage VBIAS tooperate the NMOS transistor NT514.

For example, when the comparator is used in a column-parallel singleslope AD converter in the application of a CMOS image sensor or thelike, there are some concerns in the use of the bias voltage VBIAS asfollows:

(1) Interference between columns

(2) Increase in VBIAS wiring region

(3) Use of VBIAS generation circuit.

On the other hand, the comparator 500E shown in FIG. 33 where the gateof the NMOS transistor NT514 is connected to the power supply voltagesource VDD is free from such concerns, and is particularly suitable forrealizing a column-parallel single slope AD converter.

[Fourth Circuit Configuration Example]

FIG. 34 is a diagram showing a fourth circuit configuration example of acomparator capable of reducing low-frequency noise according to theembodiment.

The comparator 500F shown in FIG. 34 is different from the comparator500C shown in FIG. 31 in the following point.

The comparator 500F additionally has a second isolator 540 between thenode (node f) ND511 on a load side and the drain terminal (node e) ofthe NMOS transistor NT511 forming an NMOS differential pair (Gmamplifier).

Because the node e has low impedance due to a diode-connected PMOS load,i.e., the node e is kept at a nearly constant voltage, the contributionof the isolation to the node e is small.

As a result, the isolation may or may not be performed on the node e.

However, the comparator 500F shown in FIG. 34 has high circuit symmetry.Therefore, the comparator 500F having an auto zero function can realizea comparison operation with higher precision.

[Fifth Circuit Configuration Example]

FIG. 35 is a diagram showing a fifth circuit configuration example of acomparator capable of reducing low-frequency noise according to theembodiment.

In the comparator 500G shown in FIG. 35, the isolator 540 of thecomparator 500F shown in FIG. 34 is formed by an NMOS transistor NT515.

The drain of the NMOS transistor NT515 is connected to the node ND511(node 0 on the load side of a first amplifier 510G, and the sourcethereof is connected to the drain (node e) of the NMOS transistor NT511forming the Gm amplifier.

Further, in the comparator 500G shown in FIG. 35, the gate of the NMOStransistor NT514 forming the isolator 530C and the gate of an NMOStransistor NT515 forming the isolator 540 are connected to the supplyline of the bias voltage VBIAS.

Thus, a constant current flows through the NMOS transistor NT514.Therefore, even if a parasitic capacitance exists between the gate(input node b) and the drain (output node c) of the NMOS transistorNT512, it is possible to suppress a voltage fluctuation and reducelow-frequency noise.

Similarly, a constant current flows through the NMOS transistor NT515.Therefore, even if a parasitic capacitance exists between the gate(input node a) and the drain (output node e) of the NMOS transistorNT511, it is possible to suppress a voltage fluctuation and reducelow-frequency noise.

Also in this case, a transistor used for isolation is not limited to adifferential pair transistor.

[Sixth Circuit Configuration Example]

FIG. 36 is a diagram showing a sixth circuit configuration example of acomparator capable of reducing low-frequency noise according to theembodiment.

The comparator 500H shown in FIG. 36 is different from the comparator500G shown in FIG. 35 in the following point.

In the comparator 500H, the gate of the NMOS transistor NT514 serving asthe isolator 530C and the gate of the NMOS transistor NT515 serving asthe isolator 540 are connected to the power supply voltage source VDDrather than being connected to the supply line of the bias voltageVBIAS.

The comparator 500G shown in FIG. 35 uses another bias voltage VBIAS tooperate the NMOS transistors NT514 and NT515.

For example, as in the case of the third circuit configuration example,when the comparator is used in a column-parallel single slope ADconverter in the application of a CMOS image sensor or the like, thereare some concerns in the use of the bias voltage VBIAS as follows:

(1) Interference between columns

(2) Increase in VBIAS wiring region

(3) Use of VBIAS generation circuit.

On the other hand, the comparator 500H shown in FIG. 36 where the gatesof the NMOS transistors NT514 and NT515 are connected to the powersupply voltage source VDD is free from such concerns, and isparticularly suitable for realizing a column-parallel single slope ADconverter.

[Effective Mounting Example]

Here, a description will be given of an effective mounting example of acomparator capable of reducing low-frequency noise according to theembodiment.

FIGS. 37(A) and 37(B) are diagrams for explaining an effective mountingexample of a comparator capable of reducing low-frequency noiseaccording to the embodiment.

As shown in FIG. 37(A), this mounting example refers to the case of thecomparator 500H shown in FIG. 36 having high asymmetry.

In FIG. 37, the NMOS differential pair transistors NT511 and NT512 arerepresented as M1 and M2, respectively. Further, the transistors NT514and NT515 for the isolation are represented as M5 and M6, respectively.

The channel widths W of the differential pair transistors M1 and M2 areset to be equal to those of the transistors M5 and M6 for the isolation.In addition, the number of fingers of the differential pair transistorsM1 and M2 is set to an odd number. Thus, the transistors M5 and M6 forthe isolation and the differential pair transistors M1 and M6 can sharea channel region.

As a result, the channel regions on the both sides of the differentialpair transistors M1 and M2 are naturally expanded.

It has been known that low-frequency noise such as flicker noise and RTSnoise can be improved with such a mounting method (Non-Patent Document1).

Accordingly, with the mounting of the present technology, low-frequencynoise can be improved according to the above two mechanisms (circuitoperation and process characteristics).

-   [Non-Patent-Document 1]-   “Impact of STA Effect on Flicker Noise in 0.13 μm RF nMOSFETs” IEEE    TRANSACTIONS ON ELECTRON DEVICES, VOL. 54, NO. 12, DECEMBER 2007,    pp. 3383-3392

As described above, the embodiment can present the following effects.

According to the present technology, it is possible to reduce the numberof the TCVs compared with an existing laminated structure withoutcausing the error in transmitting the signals. Further, no circuits suchas the quantizers (comparators) may be provided in the analog chip.Therefore, the area of the analog chip can be reduced to such an extentas to be determined by only the sensors.

For example, the area of the sensors (pixels) is determined by theoptical size of the system in the image sensor. Therefore, the area ofthe analog chip can be reduced to a nearly limit size at which theanalog chip is minimized.

As described above, the analog chip has more manufacturing stepscompared with the logic chip (digital chip). Therefore, even if the areaof the analog chip is the same as that of the logic chip, the analogchip is higher in cost than the logic chip.

Further, because the circuits are arranged at only the parts related tothe sensors in the analog chip according to the present technology, itis possible to eliminate a wiring step and a transistor manufacturingstep. In general, the transistors for manufacturing the circuits such asthe comparators and the transistors for constituting the sensors aremanufactured in steps including an uncommon step. Accordingly, theelimination of the circuits such as the comparators can reduce suchmanufacturing steps.

Similarly, because no complicated wirings have to be provided in theanalog chip, the number of the wirings can be reduced.

From the two reasons above, the present technology makes it possible tolargely reduce a cost for manufacturing the semiconductor apparatuswithout degrading the signals output from the sensors.

Further, as described above, the comparators 500C to 500H according tothe embodiment have a configuration that reduces noise with the cascodetransistors.

According to these configurations, the output node and the input nodeare paired to make comparison with a slope signal, e.g., a lamp signal,thereby preventing an effective input signal amplitude from beingattenuated. As a result, it is possible to reduce the input conversionnoise of the comparators.

As described above, it is possible to reduce noise, particularlylow-frequency noise such as flicker noise and RTS noise in thecomparators with the auto zero function and the single slope ADconverters and the solid-state image sensing apparatuses using thecomparators.

Note that the comparators having such characteristics produce a highereffect of noise reduction when being applied to the second chip servingas the digital chip of the laminated structure shown in FIG. 9.

However, when the comparators are mounted on the first chip serving asthe analog chip, they also produce a high effect of noise reduction evenin the case of a circuit configuration having no laminated structure.

Further, as described above, it is possible to reduce noise,particularly low-frequency noise such as flicker noise and RTS noise inthe single slope AD converters and the solid-state image sensingapparatuses using the comparators with the auto zero function.

Note that the embodiment describes the configurations of the CMOS imagesensors as an example of the semiconductor apparatuses. In addition, theabove configurations can be applied to, for example, backsideillumination CMOS image sensors to achieve the above effects. However,the above effects can also be substantially achieved when theconfigurations are applied to front side illumination CMOS imagesensors.

Solid-state image sensing apparatus having such configurations can beapplied as the image sensing devices of digital cameras and videocameras.

<4. Configuration Example of Camera System>

FIG. 38 is a diagram showing an example of the configuration of a camerasystem to which the solid-state image sensing apparatus according to theembodiment is applied.

As shown in FIG. 38, the camera system 600 has an image sensing device610 to which the CMOS image sensors (solid-state image sensingapparatuses) 200, 300, and 300A to 300C according to the embodiment canbe applied.

Moreover, the camera system 600 has an optical system that guidesincident light (forms a subject image on) to the pixel region of theimage sensing device 610, e.g., a lens 620 that forms an image ofincident light (image light) on an image sensing surface.

The camera system 600 has a drive circuit (DRV) 630 that drives theimage sensing device 610 and a signal processing circuit (PRC) 640 thatprocesses signals output from the image sensing device 610.

The drive circuit 630 has a timing generator (not shown) that generatesvarious timing signals including a start pulse and a clock pulse fordriving circuits inside the image sensing device 610. Based on apredetermined timing signal, the drive circuit 630 drives the imagesensing device 610.

Further, the signal processing circuit 640 applies predetermined signalprocessing to the signals output from the image sensing device 610.

The image signals processed by the signal processing circuit 640 arerecorded on, for example, a recording medium such as a memory. The imageinformation recorded on the recording medium is hard-copied by a printeror the like. Further, the image signals processed by the signalprocessing circuit 640 are displayed as moving pictures on a monitorcomposed of a liquid crystal display or the like.

As described above, the installation of any of the solid-state imagesensing apparatuses 200, 300, and 300A to 300C as the image sensingdevice 610 in an image sensing apparatus such as a digital still cameracan realize a high-precision camera.

Note that the present disclosure may also employ the followingconfigurations.

(1) A semiconductor apparatus, including:

a first chip having a plurality of sensors arranged in array form; and

a second chip, in which

the first chip and the second chip are bonded together to form alaminated structure,

a wiring between the first chip and the second chip is connected throughvia holes,

the first chip transmits signals obtained by time-discretizing analogsignals generated by the respective sensors to the second chip throughthe corresponding via holes, and

the second chip has

-   -   a function of sampling the signals transmitted from the first        chip through the via holes at a timing different from a timing        at which the signals are sampled by the first chip and    -   a function of quantizing the sampled signals to obtain digital        signals.

(2) The semiconductor apparatus according to (1), in which

the second chip samples the signals transmitted from the first chipthrough the via holes at the timing different from the timing at whichthe signals are sampled by the first chip, and quantizes the sampledsignal to obtain the digital signals.

(3) The semiconductor apparatus according to (1), in which

the second chip includes quantizers for use in continuous-timequantization and samples the signals quantized by the quantizers at thetiming different from the timing at which the signals are sampled by thefirst chip, the signals being transmitted from the first chip throughthe via holes.

(4) The semiconductor apparatus according to (1), in which

the second chip includes

-   -   comparators that compare the signals transmitted from the first        chip through the via holes with a ramp signal and output signals        based on the comparison result and    -   counters of which operations are controlled by outputs of the        comparators, the counters counting comparison times of the        corresponding comparators to perform quantization.

(5) The semiconductor apparatus according to any one of (1) to (4), inwhich

the via holes that transmit the analog signals between the first chipand the second chip and the via holes that transmit the digital signalstherebetween are arranged so as to be concentrated and separated fromeach other.

(6) A solid-state image sensing apparatus, including:

a pixel array part having a plurality of pixels arranged in matrix form,the pixels performing photoelectric conversion; and

a pixel signal reading part that reads time-discretized pixel signals inunits of the plurality of pixels from the pixel array part,

-   -   the pixel signal reading part having        -   a plurality of comparators that are arranged corresponding            to an arrangement of columns of the pixels, compare a            reading signal potential with a ramp signal, and output            signals based on the comparison result, and        -   a plurality of counters of which operations are controlled            by outputs of the comparators, the counters counting            comparison times of the corresponding comparators to perform            quantization,        -   a first chip, and        -   a second chip, in which

the first chip and the second chip are bonded together to form alaminated structure,

the first chip has the pixel array part and signal lines that transmittime-discretized analog pixel signals,

the second chip has the pixel signal reading part, and

the first chip and the second chip have a wiring connected therebetweenthrough via holes.

(7) The solid-state image sensing apparatus according to (6), in which

the via holes that transmit the analog signals between the first chipand the second chip and the via holes that transmit the digital signalstherebetween are arranged so as to be concentrated and separated fromeach other.

(8) A camera system, including:

a solid-state image sensing apparatus; and

an optical system that forms a subject image on the solid-state imagesensing apparatus, in which

the solid-state image sensing apparatus includes

-   -   a pixel array part having a plurality of pixels arranged in        matrix form, the pixels performing photoelectric conversion, and    -   a pixel signal reading part that reads time-discretized pixel        signals in units of the plurality of pixels from the pixel array        part,        -   the pixel signal reading part having            -   a plurality of comparators that are arranged                corresponding to an arrangement of columns of the                pixels, compare a reading signal potential with a ramp                signal, and output signals based on the comparison                result,            -   a plurality of counters of which operations are                controlled by outputs of the comparators, the counters                counting comparison times of the corresponding                comparators to perform quantization,            -   a first chip, and            -   a second chip,                -   the first chip and the second chip being bonded                    together to form a laminated structure,                -   the first chip having the pixel array part and                    signal lines that transmit time-discretized analog                    pixel signals,                -   the second chip having the pixel signal reading                    part,                -   the first chip and the second chip having a wiring                    connected therebetween through via holes.

(9) The camera system according to (8), in which

the via holes that transmit the analog signals between the first chipand the second chip and the via holes that transmit the digital signalstherebetween are arranged so as to be concentrated and separated fromeach other.

DESCRIPTION OF REFERENCE NUMERALS

-   100, 100A to 100G semiconductor apparatus-   110, 110A to 110G first chip (analog chip)-   111 (-0, -1, . . . ) sensor-   112 (-0, -1, . . . ) sample hold (SH) circuit-   113 (-0, -1, . . . ) amplifier-   114 (-0, -1, . . . ) TCV (via hole)-   115 (-0, -1, . . . ) sampling switch-   120, 120A to 120G second chip (logic chip, digital chip)-   121 (-0, -1, . . . ) sampling switch-   122 (-0, -1, . . . ) quantizer-   123 signal processing circuit-   124 (-0, -1, . . . ) comparator-   125 (-0, -1, . . . ) counter-   200 solid-state image sensing apparatus-   210 pixel array part-   220 row selection circuit-   230 column reading circuit-   300, 300A to 300C solid-state image sensing apparatus-   310 pixel array part-   320 row selection circuit-   330 horizontal transfer scanning circuit-   340 timing control circuit-   350 ADC group-   360 DAC (ramp signal generator)-   370 amplifier circuit (S/A)-   380 signal processing circuit-   390 horizontal transfer line-   410, 420 region where TCVs for transmitting digital signals are    arranged-   430 region where TCVs for transmitting analog signals are arranged-   500, 500A to 500H comparator-   510, 510A to 510C first amplifier-   511 Cm amplifier-   520 second amplifier-   530, 530C isolator (first isolator)-   540 isolator (second isolator)-   600 camera system-   610 image sensing device-   620 lens-   630 drive circuit-   640 signal processing circuit

1. An imaging device comprising: a first substrate including: a pixelarray unit including a plurality of pixels coupled to at least one of afloating diffusion, a reset transistor, an amplification transistor,and/or a selection transistor, respective ones of the plurality ofpixels configured to receive an incident light and output an analogsignal, and including a photoelectric conversion element and a transfertransistor, a plurality of signal lines, a signal line of the pluralityof signal lines being coupled to the plurality of pixels, a firstplurality of via holes disposed along a first side of the pixel arrayunit, and a second plurality of via holes disposed along a second sideof the pixel array unit, the second side being perpendicular to thefirst side; and a second substrate including: a column circuit includinga plurality of comparators and a plurality of counters, and at least aportion of a control circuit, wherein at least one of the firstplurality of via holes is coupled to one of the plurality ofcomparators, the portion of the control circuit is coupled to at leastone of the second plurality of via holes, and the first substrate andthe second substrate are bonded together.
 2. The imaging deviceaccording to claim 1, wherein the plurality of pixels is coupled to eachof the floating diffusion, the reset transistor, the amplificationtransistor, and the selection transistor.
 3. The imaging deviceaccording to claim 1, wherein at least one of the first plurality of viaholes and the second plurality of via holes includes a metal.
 4. Theimaging device according to claim 1, wherein the first plurality of viaholes and the second plurality of via holes are disposed in an outsideof the pixel array unit.
 5. The imaging device according to claim 1,further comprising a plurality of pads disposed in an outside of thefirst plurality of via holes and the second plurality of via holes. 6.An imaging device comprising: a first substrate including: a first pixelunit including four first pixels of a plurality of pixels in a pixelarray unit, the first pixels being arranged in a 2×2 matrix and beingcoupled to at least a first floating diffusion, respective ones of thefirst pixels including a photoelectric conversion element and a transfertransistor, a second pixel unit including four second pixels of theplurality of pixels, the second pixels being arranged in a 2×2 matrixand being coupled to at least a second floating diffusion, respectiveones of the second pixels including a photoelectric conversion elementand a transfer transistor, and a plurality of signal lines, a signalline of the plurality of signal lines coupled to the first pixel unitand the second pixel unit; and a second substrate including: a columncircuit including a plurality of comparators and a plurality ofcounters, and at least a portion of a control circuit, wherein the firstfloating diffusion is coupled to the second floating diffusion, thefirst pixel unit and the second pixel unit are coupled to the signalline by at least an amplification transistor, the first substrate andthe second substrate are bonded together, a plurality of via holes arecoupled to the first substrate and the second substrate; and at leastone of the plurality of comparators is coupled to at least one of theplurality of via holes.
 7. The imaging device according to claim 6,wherein the amplification transistor and at least one of the pluralityof via holes are disposed between the first pixel unit and the secondpixel unit in a plan view.
 8. The imaging device according to claim 6,wherein the first pixel unit and the second pixel unit are coupled to afloating diffusion, a reset transistor, a amplification transistor, anda selection transistor.
 9. The imaging device according to claim 6,wherein at least one of the plurality of via holes includes a metal. 10.The imaging device according to claim 6, wherein the plurality of viaholes includes a plurality of first via holes and a plurality of secondvia holes.
 11. The imaging device according to claim 10, wherein aplurality of first via holes is disposed along a first side of the pixelarray unit.
 12. The imaging device according to claim 11, wherein asecond plurality of via holes is disposed along a second side of thepixel array unit.
 13. The imaging device according to claim 12, whereinthe second side is perpendicular to the first side
 14. The imagingdevice according to claim 10, further comprising a plurality of padsdisposed in an outside of the first plurality of via holes and thesecond plurality of via holes.
 15. The imaging device according to claim6, wherein the plurality of via holes are disposed in an outside of thepixel array unit.
 16. The imaging device according to claim 6, whereinat least one of the plurality of signal lines is coupled to at least oneof the comparators through at least one of the plurality of via holes.17. The imaging device according to claim 6, wherein, at least theportion of the control circuit is coupled to at least one of theplurality of via holes.
 18. An imaging device comprising: a firstsubstrate including: a pixel array unit including a plurality of pixelscoupled to at least one of a floating diffusion, a reset transistor, anamplification transistor, and/or a selection transistor, respective onesof the plurality of pixels configured to receive an incident light andoutput an analog signal, and including a photoelectric conversionelement and a transfer transistor, and a plurality of signal lines, asignal line of the plurality of signal lines being coupled to theplurality of pixels; and a second substrate including a column circuitincluding a plurality of comparators and a plurality of counters,wherein the first substrate and the second substrate are bondedtogether, and a plurality of via holes is coupled to the first substrateand the second substrate.
 19. The imaging device according to claim 18,wherein the plurality of pixels is coupled to each of the floatingdiffusion, the reset transistor, the amplification transistor, and theselection transistor.
 20. The imaging device according to claim 18,wherein the plurality of via holes includes a metal.
 21. The imagingdevice according to claim 18, wherein at least a portion of a controlcircuit is disposed in the second substrate.
 22. The imaging deviceaccording to claim 21, wherein at least the portion of the controlcircuit is coupled to at least one of the plurality of via holes. 23.The imaging device according to claim 18, wherein at least one of theplurality of comparators is coupled to at least one of the plurality ofvia holes.
 24. The imaging device according to claim 18, wherein theplurality of via holes includes a plurality of first via holes and aplurality of second via holes.
 25. The imaging device according to claim24, wherein the plurality of first via holes are disposed along a firstside of the pixel array unit.
 26. The imaging device according to claim25, wherein the plurality of second via holes are disposed along asecond side of the pixel array unit.
 27. The imaging device according toclaim 26, wherein the second side is perpendicular to the first side.28. The imaging device according to claim 24, further comprising aplurality of pads disposed in an outside of the first plurality of viaholes and the second plurality of via holes.
 29. The imaging deviceaccording to claim 18, wherein the plurality of via holes are disposedin an outside of the pixel array.